1. 2. 3. material content data sheet sales product name dsl70 e6327 issued 29. august 2013 ma# MA000787194 package pg-sot143-4-10 weight* 11.92 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip non noble metal arsenic 7440-38-2 0.000 0.00 15 noble metal gold 7440-57-5 0.018 0.15 1508 inorganic material silicon 7440-21-3 0.102 0.86 1.01 8583 10106 leadframe inorganic material silicon 7440-21-3 0.001 0.01 84 non noble metal titanium 7440-32-6 0.005 0.04 420 non noble metal chromium 7440-47-3 0.015 0.13 1259 non noble metal copper 7440-50-8 4.981 41.79 41.97 417929 419692 wire noble metal gold 7440-57-5 0.108 0.91 0.91 9077 9077 encapsulation organic material carbon black 1333-86-4 0.102 0.85 8523 inorganic material antimonytrioxide 1309-64-4 0.152 1.28 12785 plastics brominated resin - 0.190 1.60 15981 plastics epoxy resin - 1.587 13.32 133176 inorganic material silicondioxide 60676-86-0 4.317 36.22 53.27 362237 532702 leadfinish non noble metal tin 7440-31-5 0.217 1.82 1.82 18174 18174 plating noble metal silver 7440-22-4 0.122 1.02 1.02 10249 10249 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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